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 SD1540
RF & MICROWAVE TRANSISTORS AVIONICS APPLICATIONS
.DESI .350 .300 .2900 .6. .REFRACTORY .EMI .30: .I
DESCRIPTION
GNED FOR HIGH POWER PULSED IFF, DME, TACAN APPLICATIONS WATTS (typ.) IFF 1030 - 1090 MHz WATTS (min.) DME 1025 - 1150 MHz WATTS (typ.) TACAN 960 - 1215 MHz 3 dB MIN. GAIN GOLD METALLIZATION T TER BALLASTING AND LOW THERMAL RESISTANCE FOR RELIABILITY AND RUGGEDNESS 1 LOAD VSWR CAPABILITY AT SPECIFIED OPERATING CONDITIONS N PUT/OUTPUT MATCHED, COMMON BASE CONFIGURATION
.400 SQ. 2LFL (M103) epoxy sealed ORDER CODE SD1540 BRANDING SD1540
PIN CONNECTION
The SD1540 is a gold metallized silicon, NPN power transistor designed for applications requiring high peak power and low duty cycles such as IFF, DME and TACAN. The SD1540 is packaged in a metal/ceramic package with internal input/output matching resulting in improved broadband performance and a low thermal resistance. ABSOLUTE MAXIMUM RATINGS (T case = 25 C)
Symbol Parameter
1. Collector 2. Base
3. Emitter 4. Base
Value
Unit
VCBO VCES VEBO IC PDISS TJ T STG
Collector-Base Voltage Collector-Emitter Voltage Emitter-Base Voltage Device Current Power Dissipation Junction Temperature Storage Temperature
65 65 3.5 22 875 +200 - 65 to +150
V V V A W C C
THERMAL DATA RTH(j-c) Junction-Case Thermal Resistance
November 1992
0.20
C/W
1/5
SD1540
ELECTRICAL SPECIFICATIONS (T case = 25 C) STATIC
Symbol Test Conditions Value Min. Typ. Max. Unit
BVCBO BVEBO ICES
IC = 10mA IE = 5mA VCE = 50V
IE = 0mA IC = 0mA IE = 0mA
65 3.5 --
-- -- --
-- -- 25
V V mA
DYNAMIC
Symbol Test Conditions Value Min. Typ. Max. Unit
POUT GP
Note:
f = 1025 -- 1150MHz PIN = 70 W f = 1025 -- 1150MHz PIN = 70 W
VCE = 50 V VCE = 50 V
300 6.3
-- --
-- --
W dB
Pulse W idth = 10Sec, Duty Cycle = 1% This device i s sui table f or use under other pulse widt h/duty cycle condit ions. Please contact the fact ory for specific appli cat ions asistance.
TYPICAL PERFORMANCE
2/5
SD1540
IMPEDANCE DATA
3/5
SD1540
TEST CIRCUIT
All Dimension are in Inches C1 C2 C3 C4, C5 L1 L2 : : : : 100pF Chip Capacitor Across .120 Sq. Gap .6 - 4.5pF JOHANSON 470pF Chip Capacitor Across .120 Sq. Gap .35 - 3.5pF Z1 Z2 Z3 Z4 Z5 Z6 Z7 Z8 : : : : : : : : .395 .250 .495 .360 .485 .520 .270 .270 x .083 x .340 x .083 x 1.193 x 1.2 x .035 x .330 x .110
: 2 3/4 Turns Diameter 16 Tinned .125 I.D. .215 Long : 2 3/4 Turns Diameter 20 Tinned .090 I.D. .220 Long
4/5
SD1540
PACKAGE MECHANICAL DATA Ref.: Dwg. No.12-0103
Information furnished is believed to be accurate and reliable. However, SGS-THOMSON Microelectronics assumes no responsability for the consequences of use of such information nor for any infringement of patents or other rights of third parties which may results from its use. No license is granted by implication or otherwise under any patent or patent rights of SGS-THOMSON Microelectronics. Specifications mentioned in this publication are subject to change without notice. This publication supersedes and replaces all information previously supplied. SGS-THOMSON Microelectronics products are not authorized for use ascritical components in life support devices or systems without express written approval of SGS-THOMSON Microelectonics. (c) 1994 SGS-THOMSON Microelectronics - All Rights Reserved SGS-THOMSON Microelectronics GROUP OF COMPANIES Australia - Brazil - France - Germany - Hong Kong - Italy - Japan - Korea - Malaysia - Malta - Morocco - The Netherlands Singapore - Spain - Sweden - Switzerland - Taiwan - Thailand - United Kingdom - U.S.A
5/5


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